<%@LANGUAGE="JAVASCRIPT" CODEPAGE="1252"%> Copper - Evaporation Material - PVD - thin film material - High purity

Copper, Cu

Chemical Properties Physical Properties
Symbol, Cu
Atomic Number, 29
Atomic Weight, 63.57
Density gms/cc, 8.96
Melting Point C, 1083
Boiling Point C, 2595
Thermal Conductivity, 400 W/cmK
Coefficient of Linear Thermal Expansion, 16.5 e-6/K


   
Available Purities - 99.99% to 99.999%
   
Available Forms -  
Pellets

1/8" x 1/8"

 
  1/4" x 1/4"  
  1/4" x 1/2"  
Starter Sources 1cc to 156cc  
Customs Shapes Manufactured to Specs  
Sputtering Targets 1" to 10" dia  

Available in mass production and small R&D quantities.

-BLANKET ORDERS- are available for large quantities, with scheduled shipments scheduled throughout the year.

For crucible suggestions - (845) 352-5800 or info@iamaterials.com

MSDS

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